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Productdetails:
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| Kleur: | Transparante zwarte | Viscositeit (25°C): | 6000±1000 mPa.s |
|---|---|---|---|
| Uithardende toestand: | 600 mJ/cm2 (LED-UV) | Hardheid: | Strand D 40 |
| Glasovergangstemperatuur (Tg): | 10°C | Diëlektrische sterkte: | 20 KV/mm |
| Houdbaarheid: | 12 maanden (8-28°C) | Verpakking: | 50g / 1kg |
| Sollicitatie: | BGA-chipversteviging, bodembevestiging van componenten | ||
| Markeren: | UV curable adhesive for BGA chips,Fast curing UV adhesive high adhesion,UV cure adhesive component bottom fixation |
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Fast Curing UV Curable Adhesive Fast Curing UV Curable Adhesive is a transparent black, LED-curable adhesive specially formulated for BGA chip stiffening and component bottom fixation. It offers high adhesion with excellent flexibility, low shrinkage and low dielectric constant, high thixotropy with good color visibility for easy dispensing, and LED 3-5 second fast curing, delivering reliable stiffening and protection for sensitive electronic components. Key Features Fast
Contactpersoon: Eric Hu
Tel.: 0086-13510152819
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