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bedrijfsnieuws over Super-curing Launches Electronic Application Series UV Curing Adhesives for Device Assembly

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Super-curing Launches Electronic Application Series UV Curing Adhesives for Device Assembly
Laatste bedrijfsnieuws over Super-curing Launches Electronic Application Series UV Curing Adhesives for Device Assembly

Super-curing has officially launched its new Electronic Application Series of UV curing adhesives, adding a set of dedicated grades designed for the fast-moving consumer electronics assembly market. The series brings together five new products that cover the full device-production workflow — from phone sealing gaskets and earphone solder joints to speaker voice coils, formed-in-place gaskets and camera module thread locking.

What's New

As devices become thinner and production lines faster, manufacturers need adhesives that cure in seconds, work without ovens and protect increasingly delicate parts. The Electronic Application Series answers this with LED/UV curable, solvent-free formulations engineered for high-throughput, automated assembly. The new lineup includes five grades dedicated to the most common electronics bonding and sealing tasks.

The Five New Grades

ModelApplicationHighlights
3508Phone sealing gasket (FIPG)Solvent free, wave/reflow resistant, high thixotropy, compression rebound
3572Earphone solder joint protection & component fixingHigh toughness, low shrinkage, low dielectric, 3-5s LED cure
3578Voice coil & diaphragm bondingHigh adhesion, low stress, red visible, 3-5s LED cure
3598Formed-in-place gasket sealingSolvent free, compression rebound, heat/water/corrosion resistant
3103 / 3108Camera module thread lockingFast cure, high strength, high hardness, heat resistant

Built for High-Speed Production

  • Fast LED/UV curing in 3-5 seconds for high-throughput lines
  • Solvent-free, low-odor formulations supporting RoHS and REACH compliance
  • High thixotropy for precise, sag-free beads
  • Low-stress cure that protects delicate components
  • Reliable adhesion to both metal and plastic substrates

Application Highlights

  • Phone sealing gasket (3508): forms a durable waterproof seal that survives wave and reflow soldering.
  • Earphone fixing (3572): protects solder joints and small components with low electrical interference.
  • Voice coil and diaphragm (3578): bonds acoustic parts with a low-stress cure and red visual feedback for easy inspection.
  • Formed-in-place gasket (3598): provides a flexible, compression-rebound seal resistant to heat, water and corrosion.
  • Camera thread locking (3103 / 3108): locks threads against vibration with fast cure, high strength and high hardness.

A Complete Electronics Toolkit

Rather than five separate products, the Electronic Application Series is a coordinated toolkit. Because every grade shares the same UV/LED curing platform and solvent-free chemistry, manufacturers can standardize curing equipment and process parameters across several assembly steps. A single lamp setup can serve sealing, fixing, bonding and thread locking, which reduces equipment complexity and operator training while improving overall line efficiency.

Meeting Real Production Needs

Across the industry, demand for slimmer devices, waterproof designs and faster cycle times continues to rise. By expanding its UV adhesive range with dedicated electronics grades, Super-curing helps manufacturers respond to these trends without sacrificing reliability. Each product was validated for the bonding, sealing and locking tasks it is designed to perform, giving customers a dependable starting point for new projects.

Availability

The Electronic Application Series is now available with flexible packaging options to suit different production volumes. Samples are available for evaluation, and our technical team can recommend the most suitable grade for each application. To learn more or request a sample, contact us today.

Bartijd : 2026-09-10 15:45:02 >> Nieuwslijst
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Shenzhen Super- curing Opto-Electronic CO., Ltd

Contactpersoon: Mr. Eric Hu

Tel.: 0086-13510152819

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